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CVE-2016-2063
Published: Aug 7, 2016
Modified: Aug 5, 2024
PUBLISHED
Description
Stack-based buffer overflow in the supply_lm_input_write function in drivers/thermal/supply_lm_core.c in the MSM Thermal driver for the Linux kernel 3.x, as used in Qualcomm Innovation Center (QuIC) Android contributions for MSM devices and other products, allows attackers to cause a denial of service or possibly have unspecified other impact via a crafted application that sends a large amount of data through the debugfs interface.
| Vendor | Product | Versions |
|---|---|---|
n/a | n/a | affected n/a |
References
92381
vdb-entry
x_refsource_BID
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