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CVE-2017-18156
Published: May 6, 2019
Modified: Aug 5, 2024
PUBLISHED
Description
While processing camera buffers in camera driver, a use after free condition can occur in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, MSM8996AU, SD 210/SD 212/SD 205, SD 625, SD 820, SD 820A, SD 835, SDX20.
| Vendor | Product | Versions |
|---|---|---|
Qualcomm Technologies, Inc. | Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear | affected MDM9206affected MDM9607affected MDM9650affected MSM8996AUaffected SD 210/SD 212/SD 205+5 more versions |
References
https://www.qualcomm.com/company/product-security/bulletins
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