CVE-2017-18157

Published: May 6, 2019

Modified: Aug 5, 2024

PUBLISHED

Description

A Use After Free Condition can occur in Thermal Engine in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SDX20.

Vendor	Product	Versions
Qualcomm Technologies, Inc.	Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear	affected `MDM9206` affected `MDM9607` affected `MDM9650` affected `MSM8909W` affected `MSM8996AU` +11 more versions

References

https://www.qualcomm.com/company/product-security/bulletins

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CVE-2017-18157

Description

Affected Products

References