CVE-2017-18329

Published: Jan 3, 2019

Modified: Aug 5, 2024

PUBLISHED

Description

Possible Buffer overflow when transmitting an RTP packet in snapdragon automobile and snapdragon wear in versions MDM9615, MDM9625, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 636, SD 650/52, SD 712 / SD 710 / SD 670, SD 810, SD 820, SD 835, SD 845 / SD 850, SDA660, SDM630, SDM660, Snapdragon_High_Med_2016, SXR1130

Vendor	Product	Versions
Qualcomm, Inc.	Snapdragon Mobile, Snapdragon Wear	affected `MDM9615, MDM9625, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 636, SD 650/52, SD 712 / SD 710 / SD 670, SD 810, SD 820, SD 835, SD 845 / SD 850, SDA660, SDM630, SDM660, Snapdragon_High_Med_2016, SXR1130`

References

https://www.qualcomm.com/company/product-security/bulletins

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106128

vdb-entry

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CVE-2017-18329

Description

Affected Products

References