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CVE-2018-11258
Published: Jul 6, 2018
Modified: Sep 16, 2024
PUBLISHED
Description
In ADSP RPC in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear, a Use After Free condition can occur in versions MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SDX20.
| Vendor | Product | Versions |
|---|---|---|
Qualcomm, Inc. | Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear | affected MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SDX20 |
References
https://www.qualcomm.com/company/product-security/bulletins
x_refsource_CONFIRM
1041432
vdb-entry
x_refsource_SECTRACK
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