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CVE-2018-5878
Published: Jul 6, 2018
Modified: Sep 16, 2024
PUBLISHED
Description
While sending the response to a RIL_REQUEST_GET_SMSC_ADDRESS message, a buffer overflow can occur in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear.
| Vendor | Product | Versions |
|---|---|---|
Qualcomm, Inc. | Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear | affected MDM9206, MDM9607, MDM9635M, MDM9650, SD 210/SD 212/SD 205, SD 615/16/SD 415, SD 625, SD 835 |
References
https://www.qualcomm.com/company/product-security/bulletins
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